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    Guseul Yun

    Sr. IC Packaging Engineer at Qualcomm

    Guseul Yun is a seasoned professional with a background in engineering and research.

    She received her education from the prestigious Georgia Institute of Technology.

    Currently, she holds the position of Sr. IC Packaging Engineer at Qualcomm, demonstrating her expertise in semiconductor packaging.

    Prior to her role at Qualcomm, Guseul Yun served as a Research Intern at the renowned IBM TJ Watson Research Center, showcasing her involvement in cutting-edge research and development projects.

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    Location

    Greater San Diego Area