Christopher Healy

Christopher Healy is a highly accomplished professional with a strong educational background in Mechanical Engineering.

He holds a Master of Science (MS) in Mechanical Engineering with an impressive GPA of 3.9 from the prestigious Georgia Institute of Technology.

Additionally, he completed his Bachelor of Science (BS) in Mechanical Engineering at the same institution, graduating with a notable GPA of 3.94.

Christopher has gained extensive experience and expertise in the field of engineering through his roles in various organizations.

Currently, he serves as a Packaging Technology Engineer at Cirrus Logic, where he contributes his skills to advance technology solutions in packaging.

Prior to his current role, Christopher held several key positions at Qualcomm, including Senior Staff IC Packaging Engineer, Staff IC Packaging Engineer, Senior IC Packaging Engineer, and IC Packaging Engineer.

Before his tenure at Qualcomm, he worked as an Intermediate IC Packaging Engineer at National Semiconductor, showcasing his diverse experience in the industry.

Christopher's journey in engineering began as a Device Package Engineering Intern at NEC Electronics, JISSO, and Production Technologies Laboratories, laying a strong foundation for his successful career.

His professional trajectory demonstrates his commitment to excellence and continuous growth in the field of Mechanical Engineering and packaging technology.

Christopher Healy's educational achievements and extensive work experience make him a valuable asset in the realm of engineering and technology.