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Omar Bchir
Principal Packaging Engineer at Amazon
Omar Bchir is a dynamic scientist and technical leader with a strong focus on innovation, troubleshooting, roadmapping, and development of successful teams. His expertise lies in IC packaging, supplier management, chemical vapor deposition, fluid dynamics, and surface characterization.
Omar Bchir pursued his Ph.D. at the University of Florida and holds a B. ChE degree from the Georgia Institute of Technology.
With a rich professional background, Omar has held key positions in renowned organizations. He was the Director of Packaging Applications at Micron Technology, Principal Packaging Engineer at Rockley Photonics Inc., Director of Engineering at Qualcomm, and Senior Packaging Engineer at Intel.
Omar Bchir has also contributed significantly to the field during his tenure as UF Alumni Graduate Fellow at the University of Florida and as an Associate Process Engineer II at Fluor.
