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    Bohan Yan

    Sr. Thermal Engineer at Qualcomm

    Bohan Yan is a Materials Science professional with a PhD from the University of California, Irvine, specializing in LED packaging. He also holds a Master's degree in materials science and engineering from Harbin Institute of Technology. Currently, he serves as a Senior Thermal Engineer at Qualcomm, bringing a wealth of experience from his previous roles as a Postdoctoral Researcher at UC Irvine, an Intern at Qualcomm, and an IC Packaging Engineer at Huawei.

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    Location

    San Diego, California