SangMin Oh

SangMin Oh is the President of Cressem, a position he has held since June 2014.1 He is based in South Korea and specializes in various technologies related to the electronics manufacturing industry.1 His areas of expertise include:

• Inspection equipment
• ACF Bonding technology
• Ultrasonic ACF bonding process
• Packaging technologies
• Mobile phone manufacturing technology
• Board assembly technology
• PWB specialist
• Mobile Phone Failure Analysis specialist
• Vision technology and Inspection (AOI)1

Career History

Before his current role, SangMin Oh held several positions:

• Head of Core technology R&D Center at Mirtec (October 2011 - June 2014)
• Director of R&D Strategy Planning at Mirtec (May 2010 - September 2011)
• External consultant at Finpro (December 2009 - April 2010)
• Senior technology manager at Nokia (August 2006 - November 2009)
• Board assembly manager at Nokia (January 2006 - July 2006)
• Board assembly specialist at Nokia (January 2000 - December 2005)1

Education

• 서울대학교 (Seoul National University): 최고경영자과정, Management Science (2021 - 2022)
• Gyeongsang National University: Master's in Metal and material engineering (1998 - 2000)
• Masan Jung-ang High school (1988 - 1991)1

At Cressem, SangMin Oh leads a company that provides packaging solutions for the electronics manufacturing industry, focusing on inline inspection equipment for semiconductor packaging processes and ultrasonic ACF bonding solutions.1