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    Jin Yang

    Thermal Architect at Intel Corporation

    Dr. Jin Yang is a recognized thermal architect at Intel Corporation, specializing in the research, design, and development of cutting-edge thermal and mechanical core technologies to fulfill the assembly and testing requirements for Intel's forthcoming wafer and electronic packages.

    With a profound background encompassing over a decade of experience in electronic packaging, thermal management spanning from component to system levels, electronics cooling, and microelectronics manufacturing, Dr. Yang is a seasoned professional in the field.

    He boasts an impressive portfolio of more than 30 peer-reviewed publications and holds over 10 patents in the domains of electronic packaging and microelectronics manufacturing, showcasing his innovative contributions to the industry.

    Dr. Yang has actively contributed to various esteemed technical committees and organizations, such as the Technical Committee of Assembly & Manufacturing Technology, ECTC, IEEE CPMT, and ASME Electronic and Photonics Packaging Division (EPPD). He has taken on pivotal roles, including General Chair of ASME InterPACK and Associate Editor for the Journal of Electronic Packaging.

    His educational journey is equally noteworthy, having pursued his Doctor of Philosophy (PhD) in Mechanical Engineering with a focus on Packaging Research Center (PRC) at Georgia Institute of Technology. Prior to that, he completed his Master of Engineering (MEng) in Mechanical Engineering from Texas A&M University and a Bachelor of Science (BS) in Precision Instruments from Tsinghua University.

    Dr. Yang's professional track record speaks volumes of his aptitude in innovation, risk-taking, teamwork, leadership, problem-solving, and multi-project management, key attributes that have propelled his numerous successes throughout his career.

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    Location

    Hillsboro, Oregon, United States