Keith Guinn

Keith Guinn is an accomplished Manufacturing/Development Engineer with over two decades of experience in the field of electronic packaging of high-performance products. His background spans across various fields, including device packaging, thermal analysis, electrical engineering, chemical engineering, and chemistry. As a principal investigator, program manager or project manager, Guinn has a track record for leading successful new product development initiatives. He has expertise in R&D, mechanical design, manufacturing, assembly, and new product introduction. Guinn brings a multi-disciplinary approach to the design and manufacturing process and prioritizes quality and continuous process improvement.

Guinn's career began with Bell Labs/AT&T/Lucent/Agere, where he was a Technical Manager. He designed interconnects for high-frequency modulator packages, Wireless Local Loop antenna packaging, and novel IC plasma etching processing diagnostic, endpoint, and process monitoring methods. With this experience, Guinn is an expert in issuing design recommendations, improving manufacturing techniques and optimizing quality. He is familiar with supporting trade design processes to balance performance margins, resource use, risk, cost, and schedule. His background has enabled him to build trusting relationships between customers, team members, line management, and vendors.

Guinn received his Doctor of Philosophy (PhD) in Chemical Engineering and Bachelor's Degree in Physical Chemistry from the University of California, San Diego, and a Master's Degree in Electrical and Electronics Engineering from Columbia University. He has held various positions in different organizations, including Senior Mechanical Engineer at Mercury Systems, Principal Development Engineer at Freedom Photonics LLC, Sr. Staff Development Engineer- Semiconductor Laser Packaging-Manufacturing Engineering at Coherent, Laboratory Test Scientist-Research & Development-New Product Development at Transonic Combustion Inc., Sr. Packaging/Integration/Test Engineer-Electronics Packaging-Manufacturing Engineering at GTRAN, Sr. Research Staff Engineer-Electronics Packaging-R&D-Thermal Engineering at HRL Laboratories, and Senior Test/Packaging Engineer at Opnext.