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    Yonghao An

    Senior Staff / Manager at Qualcomm RFFE

    Yonghao An is a professional with a specialization in Design Based Modeling, focusing on Design for Reliability, Thermal Management, Design for Manufacture, and Design for Test of Advanced Electronic Packaging in Server/HPC and Handheld segments.

    He has extensive experience working in leading companies and excels as a researcher in interdisciplinary fields such as Energy Materials, Soft Matter, Electronic Packaging, and Micro-Devices, with a successful track record in academic and industrial settings.

    Yonghao An holds a Doctor of Philosophy (PhD) in Mechanical Engineering from Arizona State University, a Master of Engineering (MEng) in Mechanics and Material Design, and a Bachelor of Science (BS) in Mechanics from the University of Science and Technology of China.

    His professional journey includes roles as a Senior Staff / Manager at Qualcomm, Staff Engineer at Qualcomm, Senior Packaging Engineer at Intel Corporation, Postdoctoral Associate at Massachusetts Institute of Technology (MIT), Lawrence Scholar at Lawrence Livermore National Laboratory, Research Associate at Arizona State University, and Research Assistant at the University of Science and Technology of China.

    Yonghao An
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    Location

    San Diego, California, United States