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    Vishesh Khanna

    IC Packaging Research and Development Engineer at Intel Corporation - UT Austin

    Vishesh Khanna is a dedicated graduate student with a Master of Science in Mechanical Engineering from The University of Texas at Austin and a Bachelor of Technology in Mechanical And Automotive Engineering from Delhi College of Engineering.

    His skill set includes proficiency in Computer-Aided Design (CAD) software like Solidworks, CATIA V5 and V6, Autodesk Fusion 360, as well as expertise in Finite Element Analysis using tools like ABAQUS CAE and ANSYS for static, dynamic, and thermal analysis.

    Vishesh is experienced in Mechanics of Materials, specializing in impact mechanics, elasticity/plasticity, fracture mechanics, and fatigue analysis.

    He has a strong background in Machine Design, Design for Manufacturing (DFM), and Design for Assembly (DFA), along with knowledge in composite material fabrication through Compression Molding.

    Additionally, Vishesh is proficient in 3D Printing, Plastic Design, Sheetmetal Design, Geometric Dimensioning and Tolerancing (GD&T), Design Failure Mode and Effect Analysis (DFMEA), and Product Lifecycle Management, showcasing his comprehensive engineering expertise.

    Throughout his career, Vishesh has held roles at prestigious organizations such as Intel Corporation, Tesla, Texas Health Catalyst at UT Austin Dell Medical School, DENSO, Indian Institute of Technology Bombay and Delhi, Maruti Suzuki India Limited, and Engifest DTU.

    With a strong academic foundation and a diverse professional background, Vishesh Khanna is now seeking opportunities to leverage his knowledge and skills in contributing to innovative engineering solutions, all while making a positive impact on society.

    Vishesh Khanna
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    Location

    Mountain View, California, United States