Timo Henttonen

Timo Henttonen is a highly skilled and experienced technical director with over 20 years of experience in the wireless industry, specializing in R&D of Mobile Products Development, Electronic Components Packaging, Printed Circuit Board, and Flexible Printed Circuits.

He holds a Master of Science (M.Sc.) in Electrical and Electronics Engineering from Tampere University of Technology.

Timo has held various managerial positions at top-tier companies like Microsoft and Nokia, including Director of IC Packaging/Silicon Development, Senior Manager of IC Packaging/Silicon Development and Operations, Senior Manager of IC Packaging, PWB & Flex Technology, and more.

His expertise lies in strategic supplier collaboration, product integration, industrialization for high volume manufacturing, and supply chain and quality management.

Timo Henttonen has a proven track record of strong leadership and a deep understanding of the technical aspects of the industry.