Ricky Zang

Ricky Zang is a proven leader with a diverse background in Operations & Supplier management and IC Packaging engineering at companies like Qualcomm, Amkor, Microchip Technology, and ASE. With extensive experience in Foundry and OSAT strategic business decisions, operation and supplier management, Ricky excels in areas such as supplier selection, capacity planning, NPI products, technology roadmap alignment, technology transition, and system and process improvements. Additionally, he has a remarkable ability to build and lead high performing teams.

Key accomplishments in Ricky's career span across venture capital investment, turnkey/outsource business model development, operation system implementation, enabling new foundry and OSAT suppliers, supplier contract negotiation, cost reduction strategy, supply chain standardization, business process automation, and breakthrough technology development. He has successfully taken technologies from research to production.

Ricky Zang's skills and expertise include Planning and Execution, Business Development, Vision, Lean Practices, Quality & Reliability, System Implementation, M & A, Team Development, Business Process, Program Management, and Technology Development.

Educationally, Ricky studied Bachelor of Science in Electrical Engineering at Old Dominion University.

Currently, Ricky Zang holds the position of Senior Director in the Advanced Product Development Division at Amkor Technology, Inc. Prior to this role, he served as the Principal Manager of IC Packaging at Qualcomm and held positions as a Packaging Engineer at Microchip Technology Inc. and ASE Group Global.