UCLA Anderson School of Management

California State University - East Bay

Hardware Executive & Entrepreneur

Novelna

Board Advisor

Skills: Fundraising · Product Development · Semiconductors · Analytical Skills · Manufacturing

Eliyan Corporation

Advisor

Assembly/packaging and reliability of silicon photonics chips, high-speed flip-chip lasers, advanced node CMOS chips, co-packaged optics

cspeed inc

VP Operations

Lead technical management of suppliers in semiconductor supply chain (wafer fab, wafer probing, assembly, etc.).
Engage with suppliers and internal cross-functional teams to negotiate contracts, resolve yield and delivery issues, and drive cost optimization.
Technical interface between internal design groups, suppliers, and manufacturing engineering organizations.
Troubleshooting and failure analysis support for internal and external manufacturing lines.
Development and characterization of optical coatings.
Manage global logistics of product transportation between suppliers and factories.
Align with senior leadership to ensure strategic plans, cost targets, and cycle time goals are met.
Manage operation and maintenance of manufacturing facilities and laboratories, including workplace services and EHS.
Lead and support the technology transfer, scale-up, validation, and launch of new products and processes per ISO9001, ISO13485, and FDA requirements.

Cepheid

VP Biochip Operations & Special Projects

Built the next generation of high-performance CMOS biochips for molecular diagnostics (MDx) and DNA sequencing applications.

Responsible for HR, finance/accounting, business development, manufacturing, QA, and legal affairs of the company. Raised over $65M from VCs and strategic investors in the U.S. and China. Managed supply chain for ICs (wafer fab to packaging), microfluidic components, optical filters, and system-level design including pricing/contract/IP negotiations.

Technical responsibilities included substrate design, proprietary optical packaging technology development, thermal/mechanical design, and fluidic component design of a complex/regulated (FDA) product. Negotiated multiple development and licensing agreements (inbound and outbound)

InSilixa (acquired by Cepheid/Danaher)

COO, Board Member

Developed a portfolio of leading edge IC packaging technologies. First IP (3D interposer) was reduced to practice and sold to Invensas (Xperi).

Vialessai Technologies

Chairman & Founder

Responsible for high-speed substrate design, packaging technology roadmap, final test development, quality and reliability of physical layer devices. Manage engineering lab for bring-up of new devices and early customer shipments.

NetLogic Microsystems (acquired by Broadcom)

VP Manufacturing, PLP

Skills: Fundraising · Product Development · Semiconductors · Venture Capital · Analytical Skills

Minah Ventures

Venture Partner

Verticle is developing high-efficiency/low-cost LEDs for solid-state lighting, TV/notebook backlights, etc.

Verticle Inc.

Member of Board of Directors

High-density and high-performance wafer probe technology

Celerity Research

Raised $28M from VCs and corporate investors such as NVIDIA. Responsible for wafer fab, packaging design, reliability/qualification, final test, supply chain, facilities and other admin functions.

Aeluros, Inc. (acquired by NetLogic)

COO, VP Manufacturing, Co-Founder, and Board Member

Design of high-frequency substrates, assembly/test vendor selection/qualification, packaging technology development.

Sirenza Microdevices (IPO in 2000 and later acquired by RF Micro Devices)

Director of Advanced Packaging

Design and development of chip-scale packaging solutions (including thermal/mechanical). Coordinated roll-out and qualification of RDRAM packages from many large global semiconductor companies which were Rambus licensees.

Rambus

Skills: Product Development · Semiconductors · Manufacturing

Nader Gamini