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Tim Reid

Sr. PCB Designer at Apple
San Francisco, California, United States
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This public profile is provided courtesy of Clay. All information found here is in the public domain.
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Tim Reid

Sr. PCB Designer at Apple
San Francisco, California, United States
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Meet Tim Reid, an experienced Senior PCB and FPC Designer with an extensive background in Mobile Telecom Hardware Product Design, R&D, and Semiconductor Wafer-level Automated Test Equipment Design. With an education focusing on Management, he has a well-rounded awareness of PCB interdependencies. His PCB Layout/Design experience includes RF & Wireless, Baseband, High-Speed Digital, Mixed-Signal, Analog, High Component Density, Embedded Passives, Advanced Materials, HDI Technology, Complex FPC/Flex Circuits, Rigid-Flex, Controlled Impedance, DDR2, DDR3, Cameras, Audio, LCD, Touchscreen, Inertial based sensors, Magnetic Field Detecting Sensor, and more. Not to mention, he has also got experience in troubleshooting and repair related to military avionics.

Tim is an expert in various PCB design tools such as Cadence Allegro, OrCAD Capture, Mentor Expedition PCB, Zuken CR-5000 BD, VeriBest PCB, PADS, and more. He has also served multiple organizations such as Apple and BlackBerry as a Senior PCB Designer.

Tim's expertise and knowledge in the PCB industry are impressive, making him a valuable asset to any organization looking for a Senior PCB/FPC designer with experience in Signal Integrity, Noise Isolation, EMI/RFI Reduction, Antenna Circuits, and Keepouts, Power Management, Robust Mechanical Performance, PCB Panelization, Thermal Mitigation, ESD Control, DFM, DFT, DFA, 2.5D/Cavity, IPC Standards, and RoHS Compliance.

This public profile is provided courtesy of Clay. All information found here is in the public domain.