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    Yan Li

    Senior Staff Packaging Engineer at Corporate Quality Network , Intel

    Yan Li is a senior staff engineer in the Corporate Quality Network of Intel Corporation, located in Chandler, Arizona.3 She has extensive experience in microelectronic packaging and failure analysis. Yan Li joined Intel in 2006 and has focused on the quality and reliability of electronic packages, understanding failure modes and mechanisms, and developing new tools and techniques for fault isolation and failure analysis.12

    Yan Li received her Ph.D. in materials science and engineering from Northwestern University in 2006, where she studied the synthesis and characterization of boron-based nanowires and nanotubes.12 She is actively involved in professional associations such as the Minerals, Metals and Materials Society (TMS), American Society for Metals (ASM) International, and Electronic Device Failure Analysis Society (EDFAS), serving as a conference organizer and session chair for more than 5 years.12

    In her role at Intel, Yan Li contributes to the development of advanced 3D microelectronic packaging technologies, which are crucial for meeting the demands of modern portable electronics for ultra-thin, ultra-light, high-performance devices with low power consumption.2

    Related Questions

    What are some of Yan Li's notable contributions to 3D microelectronic packaging?
    How has Yan Li's work impacted the reliability of electronic packages at Intel?
    What are the main challenges Yan Li addresses in her role at Intel?
    Can you provide examples of new tools and techniques Yan Li has developed for fault isolation and failure analysis?
    What professional associations is Yan Li actively involved in?
    Yan Li
    Yan Li, photo 1
    Yan Li, photo 2
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    Location

    Chandler, Arizona