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William Cheng
Lead Engineer at T. Rowe Price
William Cheng is a highly accomplished professional with a diverse educational background and extensive experience in the technology and finance sectors. He holds a BA in Computer Science and Economics, an MEng in Computer Science from Cornell University, and an MBA in Business Analytics from NYU Stern School of Business. William Cheng's academic journey began at Markham District High School.
Throughout his career, William has held key positions in reputable organizations, showcasing his expertise and leadership skills. He served as a Vice President at Goldman Sachs, a Tech Lead at Custora, and a Lead Engineer at T. Rowe Price.
William Cheng's rich educational background and experience in finance, technology, and leadership roles equip him with a unique perspective and a wide range of skills to excel in various professional settings.
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