Justice Reed

Justice Reed is a dedicated professional with a Bachelor of Science (BS) in Electrical Engineering from Northwestern University. With a commendable GPA of 3.462, Justice has a strong academic background. Justice currently holds the position of Head of Hardware at Amper Technologies, Inc., where they showcase leadership and expertise in the field. Prior to their current role, Justice gained valuable experience as a Systems Engineering Engineer at Boeing, demonstrating their skills in complex engineering systems. Justice also honed their skills as an RF Wireless and Circuitry Intern at Shure Incorporated and as an Electrical Engineering Intern at Stenograph. With a wealth of experience and a solid educational foundation, Justice Reed is a standout professional in the field of electrical engineering.