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Isaac Lagnado
Distinguished Technologist at Hewlett Packard Inc.
Isaac Lagnado is an accomplished professional with over 20 years of experience in electrical design, development, and integration of communication modules into PC products. His expertise spans the full project life cycle, including proposal development, requirements definition, design, development, test procedure development, and project documentation. Isaac has a deep understanding of system PC architecture, bus interfaces (USB, PCI, PCIe), power management, graphics, and audio subsystems. His cross-functional architectural expertise in hardware, BIOS, and Software allows him to effectively resolve issues during the integration of wireless products. He has been a key contributor to notebook engineering teams, focusing on wireless integration in notebook products. Isaac's proficiency extends to WWAN (CDMA, UMTS), WLAN (802.11abgn), and Bluetooth technologies, covering RF parametric, wireless protocol, and network security aspects. He is well-versed in using RF and test equipment such as Agilent 8960, Rohde & Schwarz CMU, spectrum analyzer, network analyzer, power meter, oscilloscope, signal generator, and CATC USB analyzer. Additionally, he has experience in software application development using Microsoft Visual C++ Studio. Isaac holds both BSEE and MSEE degrees along with multiple patents and publications. His specialties include wireless technologies (WWAN, WLAN, BT) with a focus on integration, evaluation, and debug.