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Darin Frederiksen

Module Development Engineer at Micron Technology
Boise, Idaho, United States
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Darin Frederiksen

Module Development Engineer at Micron Technology
Boise, Idaho, United States
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Darin Frederiksen is an accomplished printed circuit board (PCB) design engineer with expertise in mixed-signal, high-speed, and flexible PCB layouts. Having studied Electrical and Computer Engineering at Boise State University, he has worked with prestigious organizations such as Micron Technology, HP, Microsoft, Monsoon Solutions Inc, Cypress Semiconductor, and Micron Electronics Inc. Darin specializes in managing projects and efficiently utilizing PCB design tools like Cadence Allegro and Altium Designer, as well as CAM350.

Darin Frederiksen's years of experience have made him proficient in schematic capture, layout, and delivering successful projects. His expertise in PCB design and project management has helped him to work with complex projects over the years. He has also worked as a computer hardware tester, which has given him a comprehensive understanding of the electronics industry.

This public profile is provided courtesy of Clay. All information found here is in the public domain.
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