Daniel Wu

Daniel Wu is a highly experienced semiconductor supply chain professional with a diverse background in various roles and organizations. He holds an IMBA and an MBA from The University of Hong Kong, showcasing his strong educational foundation. Over the course of his career, Daniel has held key positions including Joint Chief Executive Officer at 上海爱浦迈科技有限公司, Head of Procurement at Yangtze Memory Technologies Co., Ltd., Vice President at National Innovation Institute of Semiconductor 3D Integrated Manufacturing, Head Of Procurement at XMC, Senior Procurement Director at YMTC, and more. With extensive experience in procurement, project management, and engineering across renowned companies like Intel Semiconductors, DuPont Protein Technologies Co., Ltd., and Anheuser-Busch, Daniel Wu brings a wealth of knowledge and expertise to the semiconductor industry.