Bob Colestock

Bob Colestock is a highly experienced Principal Electronics Packaging (Mechanical) Design Engineer with a background in Mechanical Engineering.

He completed his Bachelor of Science in Mechanical Engineering at Rochester Institute of Technology, which provided him with a solid foundation in engineering principles.

Bob has held key positions at renowned organizations, notably serving as a Principal Electronics Packaging (Mechanical) Design Engineer at Ball Aerospace.

Prior to his current role, he has also worked in electronics packaging and mechanical engineering roles at both Ball Aerospace and Honeywell Aerospace.

His diverse experience in the aerospace industry has honed his skills in electronic packaging design and mechanical engineering, making him a valuable asset in the field.