Tiefeng Shi is a highly experienced semiconductor professional with a broad range of skills and expertise in leading the development of RF products. Tiefeng has experience with different technologies, PAs, RF Front End transceivers, solid-state Microwave Oven, mobile devices, and broadband system for LTE, CDMA/WCDMA, and ISM applications. Tiefeng is an expert in high voltage and high power systems in both board and chip level, and has a solid semiconductor device development background including SiC SIT, Si, GaAs, and BJT. Tiefeng is skilled in developing high volume portable RF systems for various applications including cellular, ISM applications, land mobile, wireless power systems, and WIFI. Tiefeng is also skilled in designing low noise oscillators and superconductive circuits for high-end applications. Prior to his current position as an RF power and Wireless Power expert at GaN Systems Inc., Tiefeng has held positions at Intel Corporation, NXP acquires Freescale Semiconductor, and Microsemi Corporation.