Vered Bracha is an accomplished senior principal engineer with over two decades of experience spanning various multinational corporations. Her expertise lies in managing and leading teams of hardware, VLSI, and software engineers in both small and large companies. She excels at identifying and defining new technologies for media and AI, exploring interesting use cases introduced by novel AI, data analytics, and data distribution. Vered holds a BSC from Tel Aviv University and an EMBA from Northwestern University - Kellogg School of Management. She has garnered 23 granted patents and has several applications pending.

Vered Bracha has held various leadership roles, including her current position as Senior Principal Engineer at Intel Corporation. She has previously served as a Director of the Board at MICRON3DP - High-Speed Metal 3D Printing and as a Principal Engineer at Qualcomm. Before that, Vered worked as a WUSB project manager at Wisair, Director of VLSI at Crescendo Networks, HW Manager at Radiotel, Lead Engineer at Tellabs, Hardware Engineer at RADVISION, and as a student engineer at Scitex.